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Search results 1 until 10 of 1814

IWN 2026

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FBH is participating in this year's International Workshop on Nitride Semiconductors 2026.

IPC 2026

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FBH is presenting current research results at IEEE Photonics Conference 2026.

10 Jahre Lasermodulentwicklung der Kilowatt-Klasse am FBH: vom Konzept zum flexiblen Forschungstool

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Marko Hübner, Arnim Ginolas (FBH)

An innovative integrated reconfigurable capacitor cell for multiband operation

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FBH has developed a new capacitor cell that integrates GaN transistor switches and capacitors into a single compact structure. This reduces interconnections and chip area while enabling four…

Application laboratories (ERDF)

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Ferdinand-Braun-Institut (FBH) uses ERDF-funded application laboratories to advance III–V technologies for industrial applications. The aerospace project strengthens infrastructure for aviation and…

Publications

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The publication overview of the Ferdinand-Braun-Institut (FBH) lists scientific contributions on topics including photonics, semiconductor electronics and quantum technology. Entries provide authors…

III-V Technology

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Ferdinand-Braun-Institut combines epitaxy, materials analysis, wafer processing, assembly and packaging for III-V semiconductor devices. These technologies support photonics, integrated quantum…

III-V Electronics

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The Ferdinand-Braun-Institut (FBH) develops III-V electronics using GaN HEMT and InP HBT technologies. Its research targets efficient power generation, high frequencies and voltages, improved noise…

SUPER excitation protocol enables ultrafast, non-resonant, spin-conserving optical control of tin-vacancy centers in diamond

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We demonstrate ultrafast coherent control of tin-vacancy centers in diamond using femtosecond and SUPER excitation. This scheme enables spin-conserving, non-resonant population transfer and spectral…

Stacked corrugated horn antenna for D-Band wireless communication systems

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We developed a multilayer corrugated horn antenna for D-band applications with high radiation efficiency, low loss, and stable performance over the operating bandwidth. Its stacked-layer fabrication…