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  1. Ferdinand-Braun-Institut
  2. Research
  3. III-V Electronics
  4. RF Competence & Applications
  5. Characterization

Characterization Techniques

For characterization of devices and circuits as well as for model verification, FBH relies on high-level measurement equipment and a dedicated group of measurement engineers and scientists.

Close-up view of a semiconductor wafer with two pointed probes making contact with its surface. The wafer features intricate patterns of circuits and chips.
On-Wafer microwave measurements
Close-up of a semiconductor wafer being processed in a machine. Metallic pins are positioned above the wafer, which has a grid-like pattern.
On-Wafer microwave measurements
Close-up of a precision measurement device featuring a central probe above a rotating platform. Two robotic arms equipped with sensors are positioned beside the probe, alongside connected cables.
THz measurement system
Measuring device positioned above a wafer with integrated circuits. The device consists of two gold-colored probes attached to blue brackets.
On-wafer THz measurement system

DC Measurements

RF small signal measurements

RF Large signal measurements

Wideband Modulated Measurements

Services

These procedures are routinely performed within our current research activities. We also offer our expertise to external partners and customers in the framework of projects and contracts (consulting, measurement).