Advanced RF Competence & Applications | Ferdinand-Braun-Institut

This pages provides an overview of the advanced RF competencies that we use regarding measurement & characterization techniques, transistor modelling and EM-field simulations as well as application examples.

Close-up of an automated production machine that processes semiconductor wafers. The machine uses several pointed contacts to make precise connections on the surface of the wafer.

Characterization

of devices & circuits, discrete & on-wafer, DC (continous, pulsed), RF small- & large-signal measurements, wideband-modulated measurements

Close-up electron microscope image of a silicon microchip surface, displaying textured layers and structures. The intricate details reveal the fine patterns and elevations that form part of the chip’s architecture.

Transistor Modeling

small-signal, large-signal & noise-modeling of GaN HEMTs & InP HBTs, high-frequency switching, HEMTs in AlN & strained GaN technology

EM-Field Simulations

modeling of passive elements in integrated circuits (GaN, InP), packaging & multi-chip modules, sub-mm wave transmission lines, calibration algorithms

We use our microwave know-how to push the limits of electronics also in fields beyond the classical portfolio. This includes quantum technologies, optoelectronics and special industrial microwave applications.

Graphical simulation of an electric field. It features a central structure with surrounding vector arrows indicating field direction and strength, visualized in various colors from red to blue, reflecting different intensities of the electromagnetic field.

Microwaves for Quantum Technology

realization of quantum functionalities, planar structure of a double-loop to enable a 3-dimensional atom trap, miniaturization of atom-based quantum sensors

Close-up of a circuit board with various electronic components, including chips and connectors. Next to the circuit board is a transparent, rectangular crystal.

High-Speed Laser Drivers

ultra-short pulse widths, highest currents & high efficiency, high-speed circuits for powers >100 W

Close-up of a metallic component featuring a cylindrical nozzle emitting a fine mist. The base connects to a circuit board with various electronic elements.

Microwave Plasma

atmospheric microplasma & low-pressure plasma technology, ultra-compact microwave & ICP plasma sources

Close-up view through a circular opening, revealing a metallic interior with a light source and attached cables.

Heating with Microwaves

microwave-driven plastic pipe bending system within cooperation project KuBiMiKE, simulations of field & temperature distribution, experimental investigations