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Data Privacy
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Privacy statement in accordance with General Data Protection Regulation (GDPR) Welcome to the website of the Ferdinand-Braun-Institut (FBH) and for the interest you have shown in our research.…
GTC
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General Terms and Conditions For research and development apply our General Terms of Service of the Ferdinand-Braun-Institut gGmbH, Leibniz-Institut für Höchstfrequenztechnik (FBH) for the conduct…
Whistleblower Protection Act (Hinweisgeberschutzgesetz - HinSchG)
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Here you will find information on how whistleblowers can report possible grievances, irregularities or even violations of the law in the course of their professional activities without having to…
Third Place ARGUS Science Award for Sebastian Ahrens
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Sebastian Ahrens was awarded third place in the ARGUS Science Award for his master thesis entitled “Picosecond Pulse Generator with InP-HBT Circuit Design and Development of a Time-Domain Measurement…
High Technology Education & Training Network
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proANH e. V. The association proANH e. V. was founded in May 2019. The almost 30 members benefit from individual and exclusive support and advice on training and further education. Active applicant…
APECS Pilot Line
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Institutes cooperating in the Research Fab Microelectronics Germany (FMD) are setting up the APECS pilot line to drive forward chiplet innovations. The aim is to strengthen Europe's technological…
Ferdinand-Braun-Institut presents laser novelties at Photonics West 2025
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At Photonics West 2025 in San Francisco (USA), the Ferdinand-Braun-Institut (FBH) will be presenting novel and advanced diode lasers. FBH will be participating in both the trade fair…
Novel corrugated horn antenna technology with stripline feeding
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We developed a novel stripline-to-waveguide transition and a corrugated horn antenna, which are ideal for space applications due to their reduced size and weight. Both technologies are easily…
IEEE/SICE SII
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FBH presents latest research results at the 2025 IEEE/SICE International Symposium on System Integrations.
European Chiplet Innovation: APECS Pilot Line starts Operation in the Framework of the EU Chips Act
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The pilot line for “Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems” (APECS) marks a major leap forward in strengthening Europe’s semiconductor…