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3-dimensional integration of SiGe-BiCMOS and InP-HBT technology
/en/research/research-news/3-dimensional-integration-of-sige-bicmos-and-inp-hbt-technology
Current results from the InP-HBT high frequency circuits fabricated within the "HiTeK" project prove the capability of the developed technology platform for heterogeneous integrated…
"Ohne ehrgeizige Ziele schaffen wir nichts"
/en/media-center/media-review/ohne-ehrgeizige-ziele-schaffen-wir-nichts
Interview with Günter Stock (President BBAW) about the potentials of Berlin, among them the successful cooperation of FBH and Jenoptik Diode Lab.
Fast and efficient switching with GaN-based power-transistors
/en/research/research-news/fast-and-efficient-switching-with-gan-based-power-transistors
The FBH develops normally-off GaN transistors based on a p-GaN gate technology. Switching transistors with 150 mm gate width have been realized showing an on-state resistance RON =…
New spin-off at FBH: Thin film coating at atmospheric pressure
/en/research/research-news/new-spin-off-at-fbh-thin-film-coating-at-atmospheric-pressure
Many of our every day products, such as mobile phones, eye glasses, and flat-panel displays contain thin films deposited by cathode evaporation. Up to now, this requires bulky and costly vacuum…
Cream of the Crop: Sandwich Chips Combining the Best of Two Technologies
/en/media-center/press-releases/cream-of-the-crop-sandwich-chips-combining-the-best-of-two-technologies
The two Leibniz institutes FBH and IHP broke new technological ground and successfully combined their – up to now separate – technology worlds. Due to their high performance the novel chips developed…
Sandwich approach could meet future processing requirements
/en/media-center/media-review/sandwich-approach-could-meet-future-processing-requirements
Researchers from Ferdinand-Braun-Institut (FBH) and IHP–Leibniz-Institut für innovative Mikroelektronik in Frankfurt have integrated InP and cmos circuits on a silicon wafer. The development is…
High Brilliance Diode Lasers for Industrial Applications: BRIDLE
/en/media-center/press-releases/high-brilliance-diode-lasers-for-industrial-applications-bridle
A consortium of companies and research institutes from five European countries has joined forces in a common EC funded research project to achieve dramatic improvements in the brilliance of…
InP-Si sandwich chips combine the best of both worlds
/en/media-center/media-review/inp-si-sandwich-chips-combine-the-best-of-both-worlds
The integration of an indium phosphide chip with a silicon chip could be the key to faster and more powerful terahertz devices for high resolution and mobile applications.
Cream of the Crop: Sandwich Chips Combining the Best of Two Technologies
/en/media-center/media-review/cream-of-the-crop-sandwich-chips-combining-the-best-of-two-technologies-1
Two Leibniz institutes broke new technological ground and successfully combined their - up to now separate - technology worlds.
German research could be a route to faster computer chips
/en/media-center/media-review/german-research-could-be-a-route-to-faster-computer-chips
Researchers in Germany claim to have paved the way for faster and more powerful computer chips by combining two kinds of technology.