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Outstanding Reviewer Awards
/en/media-center/media-review/outstanding-reviewer-awards
Hans Wenzel and Carsten Netzel have been acknowledged as outstanding reviewer for „Semiconductor Science and Technology“.
Eiskaltes Kollektiv im All
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Erstmals gelingt Erzeugung eines Bose-Einstein-Kondensats im Weltraum.
The US Office of Naval Research Global Overview: External Network Facilitator for the Naval Research Enterprise
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The US Office of Naval Research Global Overview: External Network Facilitator for the Naval Research Enterprise Patrick P. Rose, PhDOffice of Naval Research Global
FBH's new CV measurement method offers more specific approach to UV LED device optimization
/en/media-center/media-review/fbhs-new-cv-measurement-method-offers-more-specific-approach-to-uv-led-device-optimization
Aluminium gallium nitride (AlGaN)-based light-emitting diodes (LEDs) with ultraviolet (UV) emission at wavelengths of 250-320nm are promising devices for applications such as water purification, gas…
Compound Semiconductor Week 2017
/en/events/compound-semiconductor-week-2017
Visit us at the CSW 2017
Semiconductor laser and PIC technology at Freedom Photonics
/en/events/semiconductor-laser-and-pic-technology-at-freedom-photonics
Semiconductor laser and PIC technology at Freedom Photonics Dr. Milan Mashanovitch (CEO)Freedom Photonics LLC
LayTec's EpiNet 2017 software enables in-situ wafer bow measurement in multi-pocket satellite configuration
/en/media-center/media-review/laytecs-epinet-2017-software-enables-in-situ-wafer-bow-measurement-in-multi-pocket-satellite-configuration
LayTec's EpiNet 2017 software enables in-situ wafer bow measurement in multi-pocket satellite configuration In-situ metrology system maker LayTec AG of Berlin, Germany says that the new release of…
Workshop on microwave technology and techniques
/en/events/workshop-on-microwave-technology-and-techniques
FBH presents recet resarch at the conference
Tight Focus Toward the Future
/en/media-center/media-review/tight-focus-toward-the-future
Cover Feature on tight material combination for millimeter-wave RF power applications: InP HBT SiGe BiCMOS heterogeneous wafer-level integration