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Search results 3981 until 3990 of 4106

Outstanding Reviewer Awards

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Hans Wenzel and Carsten Netzel have been acknowledged as outstanding reviewer for „Semiconductor Science and Technology“.

Eiskaltes Kollektiv im All

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Erstmals gelingt Erzeugung eines Bose-Einstein-Kondensats im Weltraum.

DPG-Frühjahrstagung

/en/events/dpg-fruehjahrstagung

FBH presents current research at the conference

The US Office of Naval Research Global Overview: External Network Facilitator for the Naval Research Enterprise

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The US Office of Naval Research Global Overview: External Network Facilitator for the Naval Research Enterprise Patrick P. Rose, PhDOffice of Naval Research Global

FBH's new CV measurement method offers more specific approach to UV LED device optimization

/en/media-center/media-review/fbhs-new-cv-measurement-method-offers-more-specific-approach-to-uv-led-device-optimization

Aluminium gallium nitride (AlGaN)-based light-emitting diodes (LEDs) with ultraviolet (UV) emission at wavelengths of 250-320nm are promising devices for applications such as water purification, gas…

Compound Semiconductor Week 2017

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Visit us at the CSW 2017

Semiconductor laser and PIC technology at Freedom Photonics

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Semiconductor laser and PIC technology at Freedom Photonics Dr. Milan Mashanovitch (CEO)Freedom Photonics LLC

LayTec's EpiNet 2017 software enables in-situ wafer bow measurement in multi-pocket satellite configuration

/en/media-center/media-review/laytecs-epinet-2017-software-enables-in-situ-wafer-bow-measurement-in-multi-pocket-satellite-configuration

LayTec's EpiNet 2017 software enables in-situ wafer bow measurement in multi-pocket satellite configuration In-situ metrology system maker LayTec AG of Berlin, Germany says that the new release of…

Workshop on microwave technology and techniques

/en/events/workshop-on-microwave-technology-and-techniques

FBH presents recet resarch at the conference

Tight Focus Toward the Future

/en/media-center/media-review/tight-focus-toward-the-future

Cover Feature on tight material combination for millimeter-wave RF power applications: InP HBT SiGe BiCMOS heterogeneous wafer-level integration