InP-HBT MMIC for RF Applications: Technology Roadmap and Heterointegration
H. Yacoub, C. Mangiavillano, M. Rausch, E. Dischke, W. Heinrich, P. Scheele
Published in:
16th German Microwave Conference (GeMiC 2025), Dresden, Germany, Mar. 17-19, ISBN 978-3-9820397-4-9, pp. 366-367 (2025).
Abstract:
InP-HBT monolithic microwave integrated circuits offer a tailored solution for radio frequency applications in the W- , D-band and beyond. The capabilities can be expanded further through heterointegration combining the high-frequency advantages of III–V technology and the maturity and complexity of silicon-integrated technologies such as CMOS and bipolar CMOS.
Ferdinand-Braun Institut gGmbH, Leibniz-Institut für Höchstfrequenztechnik, Germany
Keywords:
InP, HBT, Heterointegration, MMIC.
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