Search
Rules for the search
- Only words with 2 or more characters are accepted
- Max 200 chars total
- Space is used to split words, "" can be used to search for a whole string (not indexed search then)
- AND, OR and NOT are prefix words, overruling the default operator
- +/|/- equals AND, OR and NOT as operators.
- All search words are converted to lowercase
Reconciling Career & Family Life
/en/career/fbh-as-employer/career-family
We are committed to offering our employees a family-friendly working environment. Through various offers and individual arrangements, the Ferdinand-Braun-Institut enables colleagues with small…
Current Projects
/en/research/quantum-technology/integrated-quantum-sensors/current-projects
The Joint Lab Integrated Quantum Sensors at FBH is involved in the following projects: KACTUS-II: Development of miniaturised, UHV-compatible optical systems for use on atom chips QCHIP:…
Equal Opportunity
/en/career/fbh-as-employer/equal-opportunity
We strive to gradually and sustainably increase the proportion of female scientists and senior staff in the technical and scientific fields. Therefore, we are working to improve access and…
Quantum Technologies in Berlin
/en/cooperations/quantum-technologies-berlin
Events Quantum Future Academy Innovationsforum Quantentechnologien [Translate to English:] Broschüre zur Veranstaltung - Innovationsforum Quantentechnologien (pdf)Establishing value chains …
Unsubscribe
/en/media-center/subscription-service/unsubscribe
If you wish to be removed from our mailing list, please enter your email address. Select either all or only specific information that you no longer wish to receive.
Quantum Future Academy
/en/cooperations/quantum-technologies-berlin/quantum-future-academy
[Translate to English:] integrierte Quantentechnologie, Quantum Future Academy
Mounting of Laser Diodes
/en/research/iii-v-technology/mounting-assembly/laser-diodes
Laser chips - based on InAlGaAsP quantum wells on GaAs-substrates as well as InGaN quantum wells on GaN substrates - grown and processed at the FBH require a well-tuned mounting technique. The…
Mounting of III/V electronic devices
/en/research/iii-v-technology/mounting-assembly/microwave-devices
In microwave packaging, primarily FBH's semiconductor chips are processed with main focus on packing of rf power components. Beside this, packing of MMICs is realized up to the mm-wave region.
FBH - History & Development
/en/about-us/fbh-historically
The Ferdinand-Braun-Institut, Leibniz-Institut für Höchstfrequenztechnik (FBH) was formed after the German reunification from parts of former GDR Academy of Sciences institutes: “Zentralinstitut…
Joint Labs
/en/about-us/structure/joint-labs
FBH's networking approach is reflected by intensive cooperation with various universities. In several joint labs, the institute combines basic and application-oriented research: Joint Lab GaN…