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  3. European Microwave Week 2019

European Microwave Week 2019

Konferenz / Ausstellung: 29.09.-04.10 / 1.-3.10.2019 Paris, FR

The FBH is involved in several contributions to the conference:

  • A GaN-HEMT with Floating LF Ground for Reverse Operation in Integrated RF Power Circuits
  • A 300 GHz Active Frequency Tripler in Transferred-Substrate InP DHBT Technology
  • A 0.5 THz Signal Source with -11 dBm Peak Output Power Based on InP DHBT
  • GaN Digital Outphasing PA (Co-Chair of Session Outphasing and Doherty Power Amplifiers:  A. Wentzel)
  • Packaged Floating-Ground RF Power GaN-HEMT (Chair of Session Supply Modulated Power Amplifiers: O. Bengtsson)

At the accompanying exhibition you will find us at the joint booth B2200 - Research Fab Microelectronics Germany.
Conference Website