Sub-THz components for high capacity point to multipoint wireless networks
C. Paoloni1, S. Boppel2, V. Krozer3, R. Letizia1, E. Limiti4, F. Magne5, M. Marilier6, A. Ramirez7, B. Vidal8, T. Le9, R. Zimmerman9
Published in:
44th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz 2019), Paris, France, Sep.1-6, ISBN: 978-1-5386-8285-2 (2019).
Abstract:
The first point to multipoint wireless system at D-band (141 - 148.5 GHz), providing high capacity area sectors fed by high data rate G-band (275 - 305 GHz) links connected to fiber access points, will be described. It is the objective of the European Commission H2020 ULTRAWAVE "Ultra capacity wireless layer beyond 100 GHz based on millimeter wave Traveling Wave Tubes". The high transmission power provided by novel millimeter wave traveling wave tube will allow an unprecedented range and data rate at this frequency band. A novel MMIC chipset including components built by GaAs and InP processes to realize a full electronics solution for the sub-THz wireless communication system will be described.
1 Engineering Department, Lancaster University, Lancaster, LA1 4YW, United Kingdom
2 Ferdinand-Braun-Institut, Leibniz-Institut für Höchstfrequenztechnik, 12489 Berlin, Germany
3 Goethe University of Frankfurt, 60323 Frankfurt, Germany
4 University of Rome, Tor Vergata, Rome, Italy
5 When Ab, Paris, France
6 OMMIC S.A.S., Limeil Brevannes 94453, France
7 Fibernova Systems, Valencia 46022, Spain
8 Universitat Politecnica de Valencia, Valencia 46022, Spain
9 HF Systems Engineering GmbH, 34123 Kassel, Germany
Copyright © 2019 IEEE - All Rights Reserved. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.
Full version in pdf-format.