Process Robustness and Reproducibility of sub-mm Wave Flip-Chip Interconnect Assembly
S. Monayakul, S. Sinha, F.J. Schmückle, M. Hrobak, D. Stoppel, O. Krüger, B. Janke, N.G. Weimann
Published in:
IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS 2015), San Jose, CA, Oct 25-28, pp. 141-144 (2015).
Abstract:
The design margins for sub-mm-wave flip-chip transitions in three different topologies, coplanar-to-coplanar, stripline-to-coplanar, and stripline-to-stripline, were verified with the realization and S-parameter measurement of passive chip assemblies, which contain the same wiring architecture as our InP DHBT circuit integration. High yield was observed, and less than 2 dB insertion loss per transition was measured above 300 GHz on the stripline-to-stripline design.
Ferdinand-Braun-Institut, Leibniz-Institut für Höchstfrequenztechnik, Gustav-Kirchhoff-Straße 4, 12489 Berlin, Germany
Keywords:
RF, microwave, sub-mm-wave, flip-chip, stripline.
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