Chip Design

The Chip Design group deals with the design of semiconductor devices as soon as optical beam forming systems and mountings with a special focus on:

  • Development and maintenance of software tools
  • Education and training
  • Performance of simulations and analysis of experimental results

Simulation of diode lasers, amplifiers and modulators


  • Vertical layer structures and lateral waveguiding
  • Coupling strength and reflectivity of Bragg gratings
  • Thermal lensing
  • CW and pulsed electro-optical characteristics
  • Dynamical behavior and spectral characteristics
  • Modulation efficiency


  • kp8, QIP, DFB, CME, FIT, CAMFR
    In-house developments or public domain, reduced models, fast
  • WIAS-TeSCA, -LDSL, -BALaser
    Semi-commercial, accurate models, sophisticated numerics
    Commercial, complex models, user-friendly

Simulation of beam shaping optics


  • Beam collimation
  • Fiber coupling
  • Beam forming in MOPA, ECDL and SHG systems
  • Design of tailored micro lenses based on measured beam propagation parameter or Wigner distributions


  • WinABCD-2D and -3D
    paraxial approximations, propagation of (local) second order beam parameters, user-friendly and fast - the 3D version is marketed and distributed as "BeamXpertDESIGNER" by an FBH spin-off.
  • ZEMAX-EENon-sequential raytracing, modeling of beams as Schell-Gaussian ray bundles, quantitative analysis of aberrations
  • Wigner distribution

    Model for general partially coherent beams, non-interferometric measurement  (similar as M2-measurement)