Many semiconductor chips such as high-power diode lasers and microwave-power transistors can only be fully characterized when mounted onto a heatsink or encapsulated. Chips that have been processed by the FBH are thus assembled in the Mounting and Assembly Department (AVT). Subsequently, they are passed on to the Photonics Labs or the III-V-Electronics Labs for characterization and lifetime testing or are delivered to customers and partners.
The AVT laboratories for mounting of semiconductor chips occupy more that 150 sqm of cleanroom space at the FBH, featuring manual and automated work stations as well as equipment for controlling and inspection to complete the following technology steps:
- Die bonding
- Flip-chip bonding
- Wire and ribbon bonding
- Laser welding