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High-brightness diode lasers
/forschung/publikationen/high-brightness-diode-lasers
The basic concepts and some modelling aspects of high-brightness semiconductor lasers are reviewed. The technology of lasers with tapered gain-region is described. They provide the highest brightness…
Hidden resonant excitation of photoluminescence in bilayer arrays of InAs/GaAs quantum dots
/forschung/publikationen/hidden-resonant-excitation-of-photoluminescence-in-bilayer-arrays-of-inasgaas-quantum-dots
Photoluminescence (PL) of self-organized quantum dots (QDs) in bilayer InAs/GaAs structures is studied with a fixed seed layer and spacer, but variable second-layer coverage. Careful line shape…
High-efficiency AlGaInP/AlGaAs vertical-cavity surface-emitting lasers with 650 nm wavelength
/forschung/publikationen/high-efficiency-algainpalgaas-vertical-cavity-surface-emitting-lasers-with-650nbspnm-wavelength
The optimisation of red, AlGaInP/AlGaAs-based, selectively oxidised vertical-cavity surface-emitting lasers (VCSELs) with 650 nm emission wavelength having all-semiconductor p-distributed Bragg…
Midinfrared intersubband absorption in strain-compensated InGaP/InGaAs superlattices on (001) GaAs
/forschung/publikationen/midinfrared-intersubband-absorption-in-strain-compensated-ingapingaas-superlattices-on-001nbspgaas
Intersubband optical transitions in strain-compensated In0.32Ga0.68As-In0.32Ga0.68P superlattices grown using gas-source molecular-beam epitaxy on (001)GaAs are investigated by means of midinfrared…
40 GHz Hot-Via Flip-Chip Interconnects
/forschung/publikationen/40-ghz-hot-via-flip-chip-interconnects
A hot-via flip-chip interconnect for the 40 GHz band is presented. The chip in-out cell includes on-wafer probing pads and is minimized with regard to size. An optimized design shows excellent…
3D Silicon Micromachined RF Resonators
/forschung/publikationen/3d-silicon-micromachined-rf-resonators
Passive components with high quality factor are required for many applications, e.g., filters. In the field of micromachining, this is commonly achieved by using multiple-wafer structures. An…
Via Arrays for Grounding in Multilayer Packaging - Frequency Limits and Design Rules
/forschung/publikationen/via-arrays-for-grounding-in-multilayer-packaging-frequency-limits-and-design-rules
Many packaging concepts use via arrays for grounding and to eliminate parasitic modes. Such arrays represent periodic structures and change their behavior beyond a certain frequency. Proper design of…