Hybrid Micro-Integration

We turn the design of our photonic modules into very compact and robust hardware by utilizing our proprietary hybrid micro-integration technology. It is based on solder and adhesive bonding of electronic, opto-electronic, micro-mechanical and micro-optical components with ultra-high precision to carriers or very stable miniature optical benches. Our activities cover the development of proper robotic integration facilities that allow for simultaneous active alignment of multiple components with nm-resolution, the development of assembly processes, the acceptance tests for all critical components, the actual assembly, the validation of the electro-optic performance of the photonic modules and, finally, integration of the photonics modules at our partner's premesis. Depending on the project requirements we establish proper product assurance measures, specifically for the assembly of space hardware.

Compact laser module during ultra-precise hybrid micro-integration.

The robotic integration facility is based on piezo-driven, ultra-high resolution (1 nm, 1 µrad) manipulators. We currently operate setups that handle up to four components simultaneously and control the position and orientation of the latter in 18 degrees of freedom in an ISO 5 class environment. To find the optimal aligment of a set of miniature components, their positions and orientations are varried simultaneously and specific parameters, e.g. optical power, polarization state, optical emission spectrum or optical phase noise are monitored. After finishing the alignment, the optical components are adhesively bonded with UV-curing or hybrid adhesives to a miniature optical bench.

We continuously refine our micro-integration setup and processes to improve quality and reliabilty of the photonic modules. Proper measures include partial automation, specifically the simultaneous alignment of multiple degrees of freedom based on AI optimization methods, and integration of collaborative robots into the integration facility.

Tele-robotic facility used for the micro-integration of photonic modules

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Video showing an award winning tele-robotic assembly facility, which is currently under development. It is based on a combination of four ultra-high resolution robots (not shown) providing nanometer and microdegree alignment resolution, and four high-resolution industrial robots that can operate various tools - from stereo-microscopes to nanoliter dispensers for adhesives.

A tele-robotic integration facility currently under development by FBH and Robo Technology employs a human-centric operation approach based on industry 5.0 concepts: key component of the system is a digital twin for the setup and the hardware to be assembled. The digital twin is used by a human operator to configure the robotic setup, to optimize the scene, and to interactively plan and pre-validate robotic actions. An advanced human-machine interface based on, for example, AR, gesture recognition and voice control, 3D-displays, and a haptic interface tool with force feedback, allows for intuitive (bi-directional) interaction between the human operator and the robotic facility. This approach guarantees maximum flexibility and agility required for R&D and small quantity production.

Komplexe Versuchsanordnung mit verschiedenen Bauteilen, darunter ein transparentes Element mit vernetzten, flexiblen Schläuchen und metallischen Komponenten.
Robotic integration setup configured with manipulators to control the position and orientation of four components with a total of 18 degrees of freedom. © Jan Baumann (FBH)
Ein goldfarbenes elektronisches Bauteil mit mehreren Anschlüssen und einer zylindrischen Komponente in der Mitte. Neben dem Bauteil liegt eine 2-Cent-Münze zur Größenverhältnismessung.
Hybrid micro-integrated DFB-MOPA laser module. These modules form the starting point of our developments and are used, among other things, in Bose-Einstein condensate experiments in the drop tower in Bremen. © FBH/schurian.com
Eine elektronische Platine mit goldenen und schwarzen Komponenten, die verschiedene Schaltungen und Anschlussstellen zeigt. Auf der Platine sind einige Widerstände, Kondensatoren und Anschlussbuchsen sichtbar. Ein Büroklammer liegt daneben.
Hybrid micro-integrated DFB-MOPA laser module with electrical interface. These modules enable high-frequency modulation of the injection current through the integrated electrical interface. Modules of this type were used in the generation of the first Bose-Einstein condensate in space. © FBH/schurian.com
Detailaufnahme einer Leiterplatte mit verschiedenen elektronischen Bauteilen, einschließlich Widerständen, Kondensatoren und einem metallischen Element in roter Farbe.
Zoom into a micro-integrated laser module consisting of a DFB master ozcillator and a power amplifier. The center shows the DFB laser chip with Au bond wires. Micro-lenses and a miniature optical isolator are loated to the left.
Eine elektronische Platine liegt in einem goldfarbenen Gehäuse. Sie enthält verschiedene Komponenten wie Drähte, Kondensatoren und Sockel.
Extended cavity diode laser with integrated semiconductor optical amplifier. On May 13, 2018, a laser module of this type was used in the JoKaRUS experiment of German Aerospace Center DLR to realize the first iodine-based precision optical frequency reference in space, on board a sounding rocket. Similar modules will be used for precision spectroscopy and Bose-Einstein condensation experiments not only on sounding rocket missions but also on the International Space Station (ISS). © FBH/schurian.com
Eine metallische Vorrichtung mit einer eingefassten, komplexen Platine und mehreren elektrischen Komponenten. Daneben liegt ein Messschieber.
Hybrid micro-integrated spectroscopy module in a housing. This fiber-coupled module features an integrated rubidium vapor cell, phase modulator and photodiodes to enable frequency modulation or modulation transfer spectroscopy and thus frequency stabilization to an atomic transition. © FBH/N. Vlach
Nahaufnahme eines goldfarbenen Steckers, der ein kreisförmiges Muster mit einer zentralen Öffnung zeigt und ist mit einem Kabel verbunden ist.
Custom design isolated coaxial feedthroughs (3 ADC, 65 GHz signal bandwidth) for an hermetic package.
Ein kleiner Mikrochip liegt neben einer 1-Cent-Münze. Der Mikrochip ist rechteckig und hat eine goldene und schwarze Oberfläche.
Miniature thermo-electrics cooler with integrated temperature sensor used to control the temperature if volume holographic gratings with high precision.
Ein einzelner goldfarbener Zylinder mit einem blauen Draht ist neben einer 1-Cent-Münze platziert.
Ferrule carrying focussing optics and a ploarization maintaining single mode optical fiber for fiber coupling on the miniature optical bench.
Mikroisolator mit einer Öffnung, platziert auf einer 1-Cent-Münze. Das Objekt hat eine dunkle, rechteckige Form oben.
Magnet for a miniature optical isolator. The magento-optical crystal is located on top.