LTCC as MCM Substrate: Design of Strip-Line Structures and Flip-Chip Interconnects
F.-J. Schmückle, A. Jentzsch, W. Heinrich, J. Butz*, M. Spinnler*
Published in:
IEEE MTT-S Int. Microwave Symp. Dig., vol. 3, pp. 1903-1906 (2001).
Abstract:
LTCC multilayer substrates offer a cost-effective MCM solution for frequencies around 20 GHz and beyond. This paper reports on LTCC-specific transmission-line structures using a commercially available process. For the chip interconnect, a flip-chip approach contacting the backside is chosen, which, in a first step, is realized on conventional ceramics.
Ferdinand-Braun-Institut für Höchstfrequenztechnik, Albert-Einstein-Straße 11, 12489 Berlin, Germany
*Bosch Satcom GmbH, 71509 Backnang, Germany
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