W-Band Flip-Chip Interconnects on Thin-Film Substrate
F.J. Schmückle1 , A. Jentzsch1, H. Oppermann2, K. Riepe3, and W. Heinrich1
Published in:
IEEE MTT-S Int. Microwave Symp. Dig., pp. 1393-1396 (2002).
Abstract:
A flip-chip approach is presented using a thin-film microstrip line (TFMSL) on silicon as carrier substrate. Thin-film technology allows to employ cheap low-resistivity Si wafers without degrading mm-wave performance. By means of 3D em simulation, an optimized interconnect is designed for the 77 GHz band. Measurements of test strutures up to 100 GHz demonstrate the potential of this approach.
1 Ferdinand-Braun-Institut für Höchstfrequenztechnik, D-12489 Berlin, Germany
2 Fraunhofer IZM, D-13355 Berlin, Germany
3 United Monolithic Semiconductors GmbH, D-89081 Ulm, Germany
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