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Modeling of Hot-Via Technology for System-in-Package at Millimeter-wave Frequencies

Y.-F. Tsao1, Y. Wang1, S. Chevtchenko2, M. Wolf2, J. Würfl2, H.-T. Hsu1

Published in:

IEEE International Symposium on Radio-Frequency Integration Technology (RFIT 2022), Busan, Korea, Aug 29-31, ISBN 978-1-6654-6649-3, pp. 88-89 (2022).

Abstract:

Hot via technology plays an important role for system integration at millimeter-wave frequencies. Accurate prediction of the parasitics is necessary to ensure proper impedance matching for system applications. In this paper, we report the characterization of hot-via interconnect for system-in-package (SiP) applications at millimeter-wave frequencies. A test structure using microstrip to grounded coplanar waveguide (GCPW) transition has been characterized to extract the equivalent circuit model of the hot-via. The model demonstrates an excellent agreement with measurements up to 50 GHz.

1 International College of Semiconductor Technology, National Yang Ming Chiao Tung University, Hsinchu, Taiwan
2 Ferdinand-Braun-Institut gGmbH, Leibniz-Institut für Höchstfrequenztechnik, Berlin, Germany

Keywords:

hot-via, interconnect, microstrip, grounded coplanar waveguide

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