Drift Region Epitaxy Development and Characterization for High Blocking Strength and Low Specific Resistance in Vertical GaN Based Devices
E. Bahat Treidel, F. Brunner, E. Brusaterra, M. Wolf, A. Thies, J. Würfl and O. Hilt
Published in:
Int. Conf. on Compound Semiconductor Manufacturing Technology (CS ManTech 2023), Orlando, USA, May 15-18, p. 9.3 (2023).
Abstract:
We demonstrate parallel plane junction (avalanche) and punch through one dimensional pn-diodes grown on sapphire substrates and compare the results to the GaN breakdown voltage values as a function of the drift region doping concentration. For this demonstration, five different GaN on sapphire substrates with different drift region doping concentrations were grown. A power figure of merit of 1.43 GW / cm2 is observed for quasi-vertical GaN on sapphire pn-diodes with a drift region thickness of 5 µm and a doping of 1.2 × 1016 cm-3. These pn-diodes demonstrated an excellent blocking performance with hard breakdown at 920 V and a specific drift region resistance of 0.57 mΩ·cm2.
Ferdinand-Braun-Institut (FBH), Gustav-Kirchhoff-Straße 4, 12489 Berlin, Germany
Keywords:
Epitaxy, Drift Region, Vertical, GaN, Avalanche, Punch-through
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