Crosstalk Effects of Differential Thin-Film Microstrip Lines in Multilayer Motherboards

G.N. Phung1, F.J. Schmückle1, R. Doerner1, T. Fritzsch2, S. Schulz1, W. Heinrich1

Published in:

12th German Microwave Conference (GeMiC 2019), Stuttgart, Germany, Mar. 25-27, ISBN 978-3-9812668-9-4, pp. 178-181 (2019); DOI: 10.23919/GEMIC.2019.8698163 .

Copyright 2019 © IMA e.V. Ratingen, Germany. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of thiswork in other worksmust be obtained from the IMA e.V.

Abstract:

With increasing demand for miniaturization the requirements for packaging and system integration are more challenging especially when more and more components are to be integrated into a compact module. In such a situation, crosstalk effects and signal degradation due to dense layouts may become critical. The focus of this paper is on the influence of neighboring elements, discontinuities and ground layer modifications in coupled thin-film microstrip lines in differential operation. Moreover, design guidelines how to mitigate these effects are provided.

1 Ferdinand-Braun-Institut, Leibniz-Insitut für Höchstfrequenztechnik (FBH), Berlin, Germany
2 Fraunhofer Institut für Zuverlässigkeit und Mikrointegration (IZM), Berlin, Germany

Index Terms:

crosstalk effects, discontinuities, microstrip.