T. Shivan¹, M. Hossain¹, R. Doerner¹, H. Yacoub¹, T.K. Johansen², W. Heinrich¹, and V. Krozer¹

Published in:

published in IEEE Microwave and Wireless Components Letters and presented at IEEE MTT-S Int. Microw. Symp., Atlanta, USA, Jun. 20-25, Virtual Event (2021).

Abstract:

This work reports a multipurpose highly linear ultrawideband amplifier with a gain-bandwidth product (GBP) of 1.75 THz, the highest reported in any monolithic microwave integrated circuit (MMIC) process. A transimpedance amplifier is cascaded with a distributed amplifier, emulating a receiver subsystem. Using a diamond heat spreader, to dissipate heat from transistors, the cascaded amplification subsystem can achieve very high output third-order-intercept point (OIP3) from 20 to 24 dBm when measured between 5 and 65 GHz. A small-signal average gain of 24 dB is observed over a frequency range exceeding the maximum measurable bandwidth from dc to 110 GHz.vCompared with other ultrawideband MMIC amplifiers beyond 110-GHz bandwidth, the circuit offers a unique combination of high linearity (OIP3) and high gain. As a result, the cascaded amplifier is suitable for applications in optical-electrical converters, spectroscopy, and ultrawideband measurement systems in the subterahertz frequency range.

Keywords:

Distributed amplifier (DA), gain-bandwidth product (GBP), InP double heterojunction bipolar transistor (DHBT), monolithic microwave integrated circuit (MMIC).

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