Investigating Transient Thermal Response of High-Power, High-Duty-Cycle Diode Laser Stacks using FEA-Based Simulation
M. Elattar, M. Hübner, M. Wilkens, A. Ginolas and P. Crump
Published in:
IEEE Photonics Conference (IPC 2024), Rome, Italy, Nov. 10-14, ISBN 79-8-3503-6195-7, MH3.4 (2024).
Abstract:
The transient heat distribution within high-power edge-cooled diode laser stacks under high-duty-cycle pulsed operation is simulated using finite element analysis. The impact of varying pulse conditions and enhanced heat extraction on this thermal response are then investigated, aiming to scale optical power for pump applications.
Ferdinand-Braun-Institut (FBH), Gustav-Kirchhoff-Str. 4, 12489 Berlin, Germany
Keywords:
high power, diode laser, stack, pump module, high duty cycle, finite element analysis, thermal simulation
Copyright © IEEE 2024. All rights reserved.
Personal use is permitted, but republication/redistribution requires IEEE permission. See https://www.ieee.org/publications/rights/index.html for more information.
Rightslink® by Copyright Clearance Center
Full version in pdf-format.