W-Band Flip-Chip VCO in Thin-Film Environment
F.J. Schmückle1, F. Lenk1, M. Hutter2, M. Klein2, H. Oppermann2, G. Engelmann2, M. Töpper2, K. Riepe3, and W. Heinrich1
Published in:
IEEE MTT-S Int. Microw. Symp. Dig., Long Beach, USA, Jun. 17, ISBN 0-7803-8845-3, pp. 1007-1010 (2005).
Abstract:
A flip-chip packaging approach for W-band GaAs chips is presented using thin-film structures on silicon as carrier substrate. Reliability investigations indicate that, depending on bump size, the CTE mismatch is not critical and an underfiller does not provide distinctive benefits. A 77 GHz VCO GaAs-HBT MMIC is flip-chip-mounted to demonstrate validity of the packaging scheme.
1 Ferdinand-Braun-Institut für Höchstfrequenztechnik, Gustav-Kirchhoff-Straße 4, D-12489 Berlin, Germany
2 Fraunhofer IZM, D-13355 Berlin / Germany
3 United Monolithic Semiconductors GmbH, D-89081 Ulm / Germany
Index Terms:
Thin film circuit packaging, Flip-chip de-vices, MMIC oscillators. discusses two essential details of the flip-chip approach
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