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Via Arrays for Grounding in Multilayer Packaging - Frequency Limits and Design Rules

T. Tischler , M. Rudolph, A. Kilk, and W. Heinrich

Published in:

IEEE MTT-S Int. Microwave Symp. Dig., 2003, pp. 1147-1150.

Abstract:

Many packaging concepts use via arrays for grounding and to eliminate parasitic modes. Such arrays represent periodic structures and change their behavior beyond a certain frequency. Proper design of via geometry and pitch is necessary. For this purpose, electromagnetic simulation data and an equivalent circuit model are presented.

Ferdinand-Braun-Institut für Höchstfrequenztechnik, Albert-Einstein-Straße 11, D-12489 Berlin, Germany

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