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Verification of Wafer-level Calibration Accuracy at High Temperatures

A. Rumiantsev1, R. Doerner2

Published in:

IEEE MTT-S Int. Microw. Symp. Dig., Atlanta, GA, Jun. 15-20, pp. 103-106 (2008).

Abstract:

This article presents the results of accuracy verification of wafer-level calibration at high temperatures based on coplanar calibration standards. The electrical characteristics of different commercially available coplanar calibration lines were extracted and compared at different temperatures. Finally, the accuracy of lumped calibrations at variable temperatures was verified by definition of the worst-case error bounds for the measurement of passive devices and compared to the reference NIST multiline TRL.

1 SUSS MicroTec Test Systems GmbH, Suss-Str. 1, D-01561 Sacka, Germany
2 Ferdinand-Braun-Institut für Höchstfrequenztechnik, Gustav-Kirchhoff-Straße 4, D-12489 Berlin, Germany

Index Terms:

calibration, error correction, calibration comparison, scattering parameters measurement.

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