Optimized Flip-Chip Interconnect for 38 GHz Thin-Film Microstrip Multichip Modules
N.-H. Huynha, W. Heinrich, K. Hircheb, W. Scholzb, M. Warthb, W. Ehrlingerb
Published in:
IEEE MTT-S Int. Microwave Symp. Digest, vol. 1, pp. 69-72 (2000).
Abstract:
Flip-chip interconnects with 80 µm bumps are optimized for 38 GHz by means of elektromagnetic simulation. Thin-film microstrip is used as transmission-line on the carrier substrate. A compensation structure reduces reflections at the interconnect below -20 dB. Measurements of a passive structure and active chip modules proved feasibility of this approach.
a Ferdinand-Braun-Institut für Höchstfrequenztechnik, Albert-Einstein-Straße 11, 12489 Berlin, Germany
b Bosch Telecom GmbH, Backnang, Germany
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