Optimization of flip-chip interconnects for millimeter-wave frequencies
A. Jentzsch and W. Heinrich
Published in:
1999 IEEE MTT-S Int. Microwave Symp. Digest, vol. 2, pp. 637-640 (1999).
Abstract:
The mm-wave performance of flip-chip interconnects in coplanar environment is investigated. By means of electromagnetic simulation, different possibilities to improve return loss are presented and discussed. A further issue is the reduction of parasitic coupling between the chip and transmission lines on the motherboard underpassing the chip.
Ferdinand-Braun-Institut für Höchstfrequenztechnik, Albert-Einstein-Straße 11, D-12489 Berlin, Germany
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