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A 77 GHz Broadband Flip-Chip Transition on LTCC Submount
F.J. Schmückle1, U. Pursche1, W. Heinrich1, J. Purden2
1 Ferdinand-Braun-Institut für Höchstfrequenztechnik, Gustav-Kirchhoff-Straße 4, D-12489 Berlin, Germany
2 Delphi Electronics and Safety, Kokomo, In.
Published in:
IEEE MTT-S Int. Microw. Symp. Dig., Anaheim, CA, May 25-27, pp. 453-456 (2010).
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Abstract:
A flip-chip interconnect of a SiGe chip to an
LTCC submount with microstrip feeding line is presented. In
order to be compatible with cost-effective submount solutions,
bumps with 125 µm diameter and 100 µm design rules on the
LTCC side are applied. Also, the use of vias is avoided. Although
the dimensions are relatively large for the 77 GHz range,
transitions with 10 GHz bandwidth are achieved. Test structures
were manufactured and measurement results show good
agreement with simulation yielding less than 1 dB of insertion loss
at 77 GHz.
Index Terms:
Transition, Flip-Chip, LTCC, Radial stub, em simulation.
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