For characterization of layers and monitoring of process steps electrical measurements are performed on test structures (PCMs = Process control monitors) and testing devices (ig special transistors). Typically, the results are depicted as a distribution of parameters or characteristics across the wafer (maps).

Equipment: 

• 2 semi automatic waferprobers
• Probe cards with up to 18 probes
• Coplanar probes
• Current resolution <100 pA