The Back-end bridges the front-end processing of full wafers with the packaging of single chips. After DC characterization, a back-side process can be carried out to establish the desired functionality. Wafer dicing follows.

Process modules

  • Laser micro processing
  • Back-side thinning
  • Back-side process for RF devices
  • DC device characterization
  • Wafer separating techniques
    • Dicing
    • Diamond scribe and break
    • Laser scribe and break