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In-situ etching of GaAs/AlxGa1-xAs by CBr4
A. Maaßdorf, M. Weyers
Ferdinand-Braun-Institut für Höchstfrequenztechnik, Gustav-Kirchhoff-Straße 4, 12489 Berlin, Germany
Published in:
J. Cryst. Growth, vol. 310, no. 23, pp. 4754-4756 (2008).
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Abstract:
In-situ etching of GaAs and AlxGa1-xAs in LP-MOVPE has been studied using carbon tetrabromide (CBr4).
This source is routinely used by us as a source for carbon doping in GaAs and AlGaAs. The etching rate
decreases with increasing AsH3 partial pressure. While the etch rate is nearly constant for GaAs between
600 and 700°C it strongly drops towards higher temperatures with higher Al content in the layers. A
model based on blocking of the surface by non-volatile Al-Br compounds is proposed. The observed
effects allow for selective in-situ etching of GaAs against AlGaAs.
Keywords:
A1.Etching
A3. Metalorganic vapour phase epitaxy
B1. Halides
B2. Semiconducting aluminium compounds
B2. Semiconducting gallium compounds
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