Thin Film Integration of Passives - Single Components, Filters, Integrated Passive Devices

K. Zoschke, J. Wolf, M. Toepper, O. Ehrmann, T. Fritzsch, K. Scherpinski, H. Reichl, F.-J. Schmückle¹

Fraunhofer Institute for Reliability and Microintegration, Berlin, Gustav-Meyer-Allee 25, 13355 Berlin, Germany
¹ Ferdinand-Braun-Institut für Höchstfrequenztechnik, Gustav-Kirchhoff-Straße 4, D-12489 Berlin, Germany

Published in:
Electronic Components and Technology Conference, 1 - 4 June 2004, Las Vegas, Nevada USA, pp. 294-301 and in
CARTS Europe, 18 - 21 October 2004, Nice, France, pp. 126-134.
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Abstract:
The increasing demands on future electronic products require more efficient system integration technologies. Especially the package density gap at board level with the high integrated circuits (ICs) on the one and the discrete passive components on the other hand has to be closed by new packaging technologies which integrate the passive components into the substrate, an interposer or the IC itself.
This paper presents investigations for the common integration of inductors, resistors, capacitors as well as passive filter structures in a thin film build up based on copper and Benzocyclobutene (BCB). Technologies from wafer level packaging were adapted for manufactoring of the integrated components.
The examinations were carried out with special focus on integrated coils and passive filter structures. Build up, design, processing as well as results of the electrical characterization of the integrated components are described in detail. Furthermore an integrated passive device (IPD) for application as filter element in the Bluetooth band is presented.

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