40 GHz Hot-Via Flip-Chip Interconnects

F.J. Schmückle¹, A. Jentzsch¹, C. Gässler², P. Marschall², D. Geiger², and W. Heinrich¹

¹Ferdinand-Braun-Institut für Höchstfrequenztechnik, Albert-Einstein-Straße 11, D-12489 Berlin, Germany
²United Monolithic Semiconductors GmbH, D-89081 Ulm, Germany

Published in:
IEEE MTT-S Int. Microwave Symp. Dig., 2003, 1167-1170.
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Abstract:
A hot-via flip-chip interconnect for the 40 GHz band is presented. The chip in-out cell includes on-wafer probing pads and is minimized with regard to size. An optimized design shows excellent performance with 10 GHz of bandwidth and -40 dB isolation. This demonstrates the potential of the hot-via approach in mm-wave applications.

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