Via Arrays for Grounding in Multilayer Packaging - Frequency Limits and Design Rules
T. Tischler,
M. Rudolph, A. Kilk, and W. Heinrich
Ferdinand-Braun-Institut für Höchstfrequenztechnik, Albert-Einstein-Straße 11, D-12489 Berlin, Germany
Published in:
IEEE MTT-S Int. Microwave Symp. Dig., 2003, 1147-1150.
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Abstract:
Many packaging concepts use via arrays for grounding and to eliminate parasitic modes. Such arrays
represent periodic structures and change their behavior beyond a certain frequency. Proper design
of via geometry and pitch is necessary. For this purpose, electromagnetic simulation data and an
equivalent circuit model are presented.
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